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20 April 2024
 
  » arxiv » 1107.5401

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Properties and characterization of ALD grown dielectric oxides for MIS structures
S. Gieraltowska ; D. Sztenkiel ; E. Guziewicz ; M. Godlewski ; G. Luka ; B.S. Witkowski ; L. Wachnicki ; E. Lusakowska ; T. Dietl ; M. Sawicki ;
Date 27 Jul 2011
AbstractWe report on an extensive structural and electrical characterization of under-gate dielectric oxide insulators Al2O3 and HfO2 grown by Atomic Layer Deposition (ALD). We elaborate the ALD growth window for these oxides, finding that the 40-100 nm thick layers of both oxides exhibit fine surface flatness and required amorphous structure. These layers constitute a base for further metallic gate evaporation to complete the Metal-Insulator-Semiconductor structure. Our best devices survive energizing up to ~3 MV/cm at 77 K with the leakage current staying below the state-of-the-art level of 1 nA. At these conditions the displaced charge corresponds to a change of the sheet carrier density of 3 imes 1013 cm-2, what promises an effective modulation of the micromagnetic properties in diluted ferromagnetic semiconductors.
Source arXiv, 1107.5401
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