Science-advisor
REGISTER info/FAQ
Login
username
password
     
forgot password?
register here
 
Research articles
  search articles
  reviews guidelines
  reviews
  articles index
My Pages
my alerts
  my messages
  my reviews
  my favorites
 
 
Stat
Members: 3643
Articles: 2'487'895
Articles rated: 2609

29 March 2024
 
  » arxiv » 1612.4867

 Article overview


Roughness-induced domain structure in perpendicular Co/Ni multilayers
N. R. Lee-Hone ; R. Thanhoffer ; V. Neu ; R. Schäfer ; M. Arora ; R. Hübner ; D. Suess ; D. M. Broun ; E. Girt ;
Date 14 Dec 2016
AbstractWe investigate the correlation between roughness, remanence and coercivity in Co/Ni films grown on Cu seed layers of varying thickness. Increasing the Cu seed layer thickness of Ta/Cu/8x[Co/Ni] thin films increases the roughness of the films. In-plane magnetization loops show that both the remanance and coercivity increase with increasing seed layer roughness. Polar Kerr microscopy and magnetic force microscopy reveal that the domain density also increases with roughness. Finite element micromagnetic simulations performed on structures with periodically modulated surfaces provide further insight. They confirm the connection between domain density and roughness, and identify the microsocpic structure of the domain walls as the source of the increased remanence in rough films. The simulations predict that the character of the domain walls changes from Bloch-like in smooth films to N’eel-like for rougher films.
Source arXiv, 1612.4867
Services Forum | Review | PDF | Favorites   
 
Visitor rating: did you like this article? no 1   2   3   4   5   yes

No review found.
 Did you like this article?

This article or document is ...
important:
of broad interest:
readable:
new:
correct:
Global appreciation:

  Note: answers to reviews or questions about the article must be posted in the forum section.
Authors are not allowed to review their own article. They can use the forum section.

browser claudebot






ScienXe.org
» my Online CV
» Free


News, job offers and information for researchers and scientists:
home  |  contact  |  terms of use  |  sitemap
Copyright © 2005-2024 - Scimetrica