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23 April 2024 |
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Atom Chips: Fabrication and Thermal Properties | | S. Groth
; P. Krüger
; S. Wildermuth
; R. Folman
; T. Fernholz
; D. Mahalu
; I. Bar-Joseph
; J. Schmiedmayer
; | | Date: |
6 Apr 2004 | | Journal: | Applied Physics Letters, Vol. 85, No. 14, pp. 2980--2982, 2004 | | Subject: | Materials Science; Soft Condensed Matter | cond-mat.mtrl-sci cond-mat.soft | | Abstract: | Neutral atoms can be trapped and manipulated with surface mounted microscopic current carrying and charged structures. We present a lithographic fabrication process for such atom chips based on evaporated metal films. The size limit of this process is below 1$mu$m. At room temperature, thin wires can carry more than 10$^7$A/cm$^2$ current density and voltages of more than 500V. Extensive test measurements for different substrates and metal thicknesses (up to 5 $mu$m) are compared to models for the heating characteristics of the microscopic wires. Among the materials tested, we find that Si is the best suited substrate for atom chips. | | Source: | arXiv, cond-mat/0404141 | | Services: | Forum | Review | PDF | Favorites | |
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